IEC PAS 62483:2006 ED1

Test method for measuring whisker growth on tin and tin alloy surface finishes

Publication date:   Sep 12, 2006

General information

99.60   Withdrawal effective   Sep 25, 2013

IEC

TC 47

Publicly Available Specification

31.080.01   Semiconductor devices in general

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Scope

Provides the methodology applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not be sufficient for applications with special requirements, e.g., military or aerospace. Additional requirements may be specified in the appropriate requirements document

Life cycle

NOW

WITHDRAWN
IEC PAS 62483:2006 ED1
99.60 Withdrawal effective
Sep 25, 2013

REVISED BY

PUBLISHED
IEC 62483:2013 ED1