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IEC PAS 62204:2000 ED1

Standard method for measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line IEC PAS 62204:2000 ED1

Publication date:   Nov 28, 2000

95.99   Withdrawal of Standard   May 17, 2004

General information

95.99   Withdrawal of Standard   May 17, 2004

IEC

TC 47

Publicly Available Specification

31.080.01   Semiconductor devices in general

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Scope

Aims at determining the temperature coefficient of resistance (at a given reference temperature) of aluminium and aluminium-alloy thin-film metallization that are used in microelectronic circuits and devices.
This method is intended for estimating a mean temperature of a metallization line stressed in an accelerated electromigration stress test before any irreversible change in resistivity occurs due to the current-density and temperature stresses imposed.

Life cycle

NOW

WITHDRAWN
IEC PAS 62204:2000 ED1
95.99 Withdrawal of Standard
May 17, 2004




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