Aims at evaluating the moisture resistance of nonhermetic packaged solid state devices. Employs severe conditions of pressure, humidity and temperature that accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors that pass through it.
WITHDRAWN
IEC PAS 62172:2000 ED1
99.60
Withdrawal effective
Mar 9, 2004
PUBLISHED
IEC 60749-33:2004 ED1