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IEC PAS 62170:2000 ED1

Bond wire modeling standard IEC PAS 62170:2000 ED1

Publication date:   Aug 24, 2000

95.99   Withdrawal of Standard   May 17, 2004

General information

95.99   Withdrawal of Standard   May 17, 2004

IEC

TC 47

Publicly Available Specification

31.080.01   Semiconductor devices in general

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Scope

Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers.
Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.

Life cycle

NOW

WITHDRAWN
IEC PAS 62170:2000 ED1
95.99 Withdrawal of Standard
May 17, 2004




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