IEC PAS 61249-3-1:2007 ED1

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Publication date:   May 30, 2007

95.99   Withdrawal of Standard   Jan 9, 2015

General information

95.99   Withdrawal of Standard   Jan 9, 2015

IEC

TC 91

Publicly Available Specification

31.180   Printed circuits and boards

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Scope

Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types

Life cycle

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WITHDRAWN
IEC PAS 61249-3-1:2007 ED1
95.99 Withdrawal of Standard
Jan 9, 2015