IEC PAS 61249-3-1:2007 ED1
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Publication date:
May 30, 2007
95.99
Withdrawal of Standard
Jan 9, 2015
General information
Current stage:
95.99
Withdrawal of Standard
Jan 9, 2015
Originator:
IEC
Owner:
TC 91
Type:
Publicly Available Specification
ICS:
31.180
Printed circuits and boards
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Languages:
English
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Scope
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
Life cycle
NOW
WITHDRAWN
IEC PAS 61249-3-1:2007 ED1
95.99
Withdrawal of Standard
Jan 9, 2015