0

IEC PAS 61249-3-1:2007 ED1

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) IEC PAS 61249-3-1:2007 ED1

Publication date:   May 30, 2007

95.99   Withdrawal of Standard   Jan 9, 2015

General information

95.99   Withdrawal of Standard   Jan 9, 2015

IEC

TC 91

Publicly Available Specification

31.180   Printed circuits and boards

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types

Life cycle

NOW

WITHDRAWN
IEC PAS 61249-3-1:2007 ED1
95.99 Withdrawal of Standard
Jan 9, 2015




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version