IEC 63761 ED1

Thermography test method for defects circuit interconnection defects

General information

30.20   CD study/ballot initiated   Aug 7, 2026

PCC    Oct 2, 2026

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
IEC 63761 ED1
30.20 CD study/ballot initiated
Aug 7, 2026