Menu

0

IEC 63609-3 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples

General information

30.60   Close of voting/ comment period   Mar 6, 2026

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
IEC 63609-3 ED1
30.60 Close of voting/ comment period
Mar 6, 2026