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IEC 63609-2 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements IEC 63609-2 ED1

General information

40.00   DIS registered   Jul 31, 2026

CCDV    Sep 18, 2026

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

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IN_DEVELOPMENT
IEC 63609-2 ED1
40.00 DIS registered
Jul 31, 2026




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