IEC 63378-6-2 ED1

Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

Current stage: 20.99 WD approved for registration as CD Jul 31, 2026

Next stage: CD Next stage date : Dec 25, 2026

Originator: IEC

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

IN_DEVELOPMENT
IEC 63378-6-2 ED1
20.99 WD approved for registration as CD
Jul 31, 2026