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IEC 63378-6-2 ED1

Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device IEC 63378-6-2 ED1

General information

20.99   WD approved for registration as CD   Jul 31, 2026

CD    Dec 25, 2026

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

Life cycle

NOW

IN_DEVELOPMENT
IEC 63378-6-2 ED1
20.99 WD approved for registration as CD
Jul 31, 2026




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