IEC 63378-6-1 ED1

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

Current stage: 60.00 Standard under publication May 11, 2026

Next stage: BPUB Next stage date : Aug 3, 2026

Originator: IEC

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

IN_DEVELOPMENT
IEC 63378-6-1 ED1
60.00 Standard under publication
May 11, 2026