IEC 63378-2-3 ED1

Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages

Current stage: 20.99 WD approved for registration as CD Jul 31, 2026

Next stage: CD Next stage date : Jan 29, 2027

Originator: IEC

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

IN_DEVELOPMENT
IEC 63378-2-3 ED1
20.99 WD approved for registration as CD
Jul 31, 2026