IEC 63378-2-2 ED1

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

Current stage: 60.00 Standard under publication Sep 9, 2026

Next stage: DECPUB Next stage date : Oct 28, 2026

Originator: IEC

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

IN_DEVELOPMENT
IEC 63378-2-2 ED1
60.00 Standard under publication
Sep 9, 2026