Published
IEC 63287-3:2026 specifies guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life.
Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices.
This document is not intended for medical, military, aeronautics and astronautics-related applications.
NOTE Throughout the document, the term power semiconductor module refers to multichip semiconductor power modules as defined in IEC 60191-4.
PUBLISHED
IEC 63287-3:2026 ED1
60.60
Standard published
Aug 6, 2026
