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IEC 63215-4 ED1

Endurance test methods for die attach materials – Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices

General information

30.98   Project deleted   Sep 18, 2023

IEC

TC 91

International Standard

31.190   Electronic component assemblies

Life cycle

NOW

ABANDON
IEC 63215-4 ED1
30.98 Project deleted
Sep 18, 2023