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IEC 63215-4 ED1

Endurance test methods for die attach materials – Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices IEC 63215-4 ED1

General information

30.98   Project deleted   Sep 18, 2023

IEC

TC 91

International Standard

31.190   Electronic component assemblies

Life cycle

NOW

ABANDON
IEC 63215-4 ED1
30.98 Project deleted
Sep 18, 2023




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