IEC 62899-402-8:2026 specifies the measurement methods of the dimensions of the shape patterns in printed electronics. These printed patterns are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for vertical variance in IEC TR 62899‑402‑4 in printed electronics.
NOTE The measurement methods of dimensions of the shape patterns considering three-dimensional characteristics can be developed later after the measurement methods for vertical variance are established.
PUBLISHED
IEC 62899-402-8:2026 ED1
60.60
Standard published
Jun 4, 2026