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IEC 62899-402-8:2026 ED1

Printed electronics - Part 402-8: Printability - Measurement of qualities - Shape pattern dimension IEC 62899-402-8:2026 ED1

Publication date:   Jun 4, 2026

General information

60.60   Standard published   Jun 4, 2026

IEC

TC 119

International Standard

31.180   Printed circuits and boards

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Scope

IEC 62899-402-8:2026 specifies the measurement methods of the dimensions of the shape patterns in printed electronics. These printed patterns are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for vertical variance in IEC TR 62899‑402‑4 in printed electronics.
NOTE The measurement methods of dimensions of the shape patterns considering three-dimensional characteristics can be developed later after the measurement methods for vertical variance are established.

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PUBLISHED
IEC 62899-402-8:2026 ED1
60.60 Standard published
Jun 4, 2026




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