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IEC 62899-202-9:2023 ED1

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test IEC 62899-202-9:2023 ED1

Publication date:   Aug 3, 2023

General information

60.60   Standard published   Aug 3, 2023

IEC

TC 119

International Standard

31.180   Printed circuits and boards | 87.080   Inks. Printing inks

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Scope

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

Life cycle

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PUBLISHED
IEC 62899-202-9:2023 ED1
60.60 Standard published
Aug 3, 2023




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