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IEC 62899-202-5:2018 ED1

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

Publication date:   Sep 28, 2018

General information

60.60 Standard published   Sep 28, 2018

IEC

TC 119

International Standard

31.180   Printed circuits and boards | 87.080   Inks. Printing inks

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Scope

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

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PUBLISHED
IEC 62899-202-5:2018 ED1
60.60 Standard published
Sep 28, 2018