IEC 62878-2-604 ED1

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

Current stage: 30.99 CD approved for registration as DIS Aug 7, 2026

Next stage: TCDV Next stage date : Dec 17, 2026

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 Printed circuits and boards | 31.190 Electronic component assemblies

IN_DEVELOPMENT
IEC 62878-2-604 ED1
30.99 CD approved for registration as DIS
Aug 7, 2026