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IEC 62878-2-603:2025 ED1

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity IEC 62878-2-603:2025 ED1

Publication date:   Feb 25, 2025

General information

60.60   Standard published   Feb 25, 2025

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

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PUBLISHED
IEC 62878-2-603:2025 ED1
60.60 Standard published
Feb 25, 2025




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