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IEC 62769-6:2023 ED3

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings IEC 62769-6:2023 ED3

Publication date:   Apr 6, 2023

General information

60.60 Standard published   Apr 6, 2023

IEC

TC 65/SC 65E

International Standard

25.040.40   Industrial process measurement and control | 35.100.05   Multilayer applications

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IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

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PREVIOUSLY

WITHDRAWN
IEC 62769-6:2021 ED2

NOW

PUBLISHED
IEC 62769-6:2023 ED3
60.60 Standard published
Apr 6, 2023