IEC 62453-302:2023 provides information for integrating the CIP™ technology into the FDT interface specification (IEC 62453‑2). Communication Profile Family 2 (commonly known as CIP™[1]) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet™[2]), CP 2/2 (EtherNet/IP™[3]), and CP 2/3 (DeviceNet™1) are defined in IEC 61784‑1 and IEC 61784‑2. An additional communication profile (CompoNet™1), also based on CIP™, is defined in IEC 62026-7. This part of IEC 62453 specifies communication and other services. This specification neither contains the FDT specification nor modifies it.
[1] CIP™ (Common Industrial Protocol), DeviceNet™ and CompoNet™ are trade names of Open DeviceNet Vendor Association, Inc (ODVA). This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trade name holder or any of its products. Compliance to this standard does not require use of the trade names CIP™, DeviceNet™ or CompoNet™. Use of the trade names CIP™, DeviceNet™ or CompoNet™ requires permission of Open DeviceNet Vendor Association, Inc.
[2] ControlNet™ is a trade name of ControlNet International, Ltd. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance to this profile does not require use of the trade name ControlNet™. Use of the trade name ControlNet™ requires permission of ControlNet International, Ltd.
[3] EtherNet/IP™ is a trade name of ControlNet International, Ltd. and Open DeviceNet Vendor Association, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance to this profile does not require use of the trade name EtherNet/IP™. Use of the trade name EtherNet/IP™ requires permission of either ControlNet International, Ltd. or Open DeviceNet Vendor Association, Inc.
WITHDRAWN
IEC 62453-302:2016 ED2
PUBLISHED
IEC 62453-302:2023 ED3
60.60
Standard published
Nov 8, 2023