IEC 62418:2010 ED1

Name: IEC 62418:2010 ED1
Brand: IEC
SKU: IEC 62418:2010 ED1
Price: 139.15 EUR
Availability: InStock
Rating: 5 (65 reviews)

Semiconductor devices - Metallization stress void test

Publication date: Apr 22, 2010

General information

Current stage: 60.60 Standard published Apr 22, 2010

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01 Semiconductor devices in general

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Status: Published

PDF - €139.15

Languages: English French

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Scope

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Life cycle

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PUBLISHED
IEC 62418:2010 ED1
60.60 Standard published
Apr 22, 2010