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IEC 62047-63 ED1

Semiconductor devices - Micro-electromechanical systems - Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading

General information

30.20   CD study/ballot initiated   Jul 31, 2026

PCC    Sep 25, 2026

IEC

TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices

Life cycle

NOW

IN_DEVELOPMENT
IEC 62047-63 ED1
30.20 CD study/ballot initiated
Jul 31, 2026