IEC 62047-63 ED1

Semiconductor devices - Micro-electromechanical systems - Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading

Current stage: 30.99 CD approved for registration as DIS Oct 2, 2026

Next stage: TCDV Next stage date : Feb 26, 2027

Originator: IEC

Type: International Standard

ICS: 31.080.99 Other semiconductor devices

IN_DEVELOPMENT
IEC 62047-63 ED1
30.99 CD approved for registration as DIS
Oct 2, 2026