IEC 62047-63 ED1

Semiconductor devices - Micro-electromechanical systems - Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading IEC 62047-63 ED1

Current stage: 30.20 CD study/ballot initiated Jul 31, 2026

Next stage: PCC Next stage date : Sep 25, 2026

Originator: IEC

Type: International Standard

ICS: 31.080.99 Other semiconductor devices

IN_DEVELOPMENT
IEC 62047-63 ED1
30.20 CD study/ballot initiated
Jul 31, 2026

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version