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IEC 62047-63 ED1

Semiconductor devices - Micro-electromechanical systems - Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading IEC 62047-63 ED1

General information

30.99   CD approved for registration as DIS   Oct 2, 2026

TCDV    Feb 26, 2027

IEC

TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices

Life cycle

NOW

IN_DEVELOPMENT
IEC 62047-63 ED1
30.99 CD approved for registration as DIS
Oct 2, 2026




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