IEC 62047-62 ED1

Semiconductor devices - Micro-electromechanical systems - Part 62: Electrical resistance test method for hybrid MEMS materials under combined tensile and torsional deformation

Current stage: 30.99 CD approved for registration as DIS Sep 4, 2026

Next stage: TCDV Next stage date : Feb 26, 2027

Originator: IEC

Type: International Standard

ICS: 31.080.99 Other semiconductor devices

IN_DEVELOPMENT
IEC 62047-62 ED1
30.99 CD approved for registration as DIS
Sep 4, 2026