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IEC 62047-13:2012 ED1

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

Publication date:   Feb 28, 2012

General information

60.60 Standard published   Feb 28, 2012

IEC

TC 47/SC 47F

International Standard

31.080.99   Other semiconductor devices

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Scope

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.

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PUBLISHED
IEC 62047-13:2012 ED1
60.60 Standard published
Feb 28, 2012