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IEC 61249-5-1:1995 ED1

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

Publication date:   Nov 28, 1995

General information

60.60 Standard published   Nov 28, 1995

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60249-3A:1976 ED1

NOW

PUBLISHED
IEC 61249-5-1:1995 ED1
60.60 Standard published
Nov 28, 1995