IEC 61192-4:2002 ED1

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies IEC 61192-4:2002 ED1

Publication date:   Nov 29, 2002

Scope

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.