IEC 61192-3:2002 ED1

Name: IEC 61192-3:2002 ED1
Brand: IEC
SKU: IEC 61192-3:2002 ED1
Price: 356.95 EUR
Availability: InStock
Rating: 5 (66 reviews)

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

Publication date: Dec 17, 2002

95.99 Withdrawal of Standard Nov 30, 2018

General information

Current stage: 95.99 Withdrawal of Standard Nov 30, 2018

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190 Electronic component assemblies

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Status: Withdrawn

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Languages: English French

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Scope

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

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WITHDRAWN
IEC 61192-3:2002 ED1
95.99 Withdrawal of Standard
Nov 30, 2018