IEC 61192-1:2003 ED1

Workmanship requirements for soldered electronic assemblies - Part 1: General IEC 61192-1:2003 ED1

Publication date:   Feb 20, 2003

95.99   Withdrawal of Standard   Nov 30, 2018

General information

95.99   Withdrawal of Standard   Nov 30, 2018

IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Scope

Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.

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IEC 61192-1:2003 ED1
95.99 Withdrawal of Standard
Nov 30, 2018




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