0

IEC 61191-10-2 ED1

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate IEC 61191-10-2 ED1

General information

40.20   DIS ballot initiated: 12 weeks   Aug 21, 2026

PRVC    Nov 13, 2026

IEC

TC 91

International Standard

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

Life cycle

NOW

IN_DEVELOPMENT
IEC 61191-10-2 ED1
40.20 DIS ballot initiated: 12 weeks
Aug 21, 2026




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version