IEC 61190-1-3 ED4

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Current stage: 20.99 WD approved for registration as CD Dec 20, 2024

Next stage: CD Next stage date : Jun 30, 2026

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190 Electronic component assemblies

IN_DEVELOPMENT
IEC 61190-1-3 ED4
20.99 WD approved for registration as CD
Dec 20, 2024