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IEC 61190-1-1:2002 ED1

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Publication date:   Mar 25, 2002

General information

60.60   Standard published   Mar 25, 2002

IEC

TC 91

International Standard

31.190   Electronic component assemblies

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Scope

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

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PUBLISHED
IEC 61190-1-1:2002 ED1
60.60 Standard published
Mar 25, 2002