IEC 61189-6:2006 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Publication date:   Jul 24, 2006

95.99   Withdrawal of Standard   Apr 2, 2024

General information

95.99   Withdrawal of Standard   Apr 2, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-6:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

Life cycle

NOW

WITHDRAWN
IEC 61189-6:2006 ED1
95.99 Withdrawal of Standard
Apr 2, 2024

REVISED BY

PUBLISHED
IEC 61189-5-501:2021 ED1

PUBLISHED
IEC 61189-5-502:2021 ED1