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IEC 61189-5-501 ED2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes IEC 61189-5-501 ED2

General information

40.00   DIS registered   Jul 31, 2026

CCDV    Sep 18, 2026

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Life cycle

PREVIOUSLY

PUBLISHED
IEC 61189-5-501:2021 ED1

NOW

IN_DEVELOPMENT
IEC 61189-5-501 ED2
40.00 DIS registered
Jul 31, 2026




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