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IEC 61189-3-719:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling IEC 61189-3-719:2016 ED1

Publication date:   Jan 5, 2016

General information

60.60 Standard published   Jan 5, 2016

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Life cycle

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PUBLISHED
IEC 61189-3-719:2016 ED1
60.60 Standard published
Jan 5, 2016