IEC 61189-3-302 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) IEC 61189-3-302 ED1

Current stage: 40.20 DIS ballot initiated: 12 weeks Oct 4, 2024

Next stage: PRVC Next stage date : Dec 27, 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 Printed circuits and boards

IN_DEVELOPMENT
IEC 61189-3-302 ED1
40.20 DIS ballot initiated: 12 weeks
Oct 4, 2024