IEC 61189-3-302 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) IEC 61189-3-302 ED1

Current stage: 30.20 CD study/ballot initiated Mar 8, 2024

Next stage: PCC Next stage date : May 31, 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 Printed circuits and boards

IN_DEVELOPMENT
IEC 61189-3-302 ED1
30.20 CD study/ballot initiated
Mar 8, 2024