IEC 61189-3-302 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) IEC 61189-3-302 ED1

Current stage: 30.60 Close of voting/ comment period May 31, 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 Printed circuits and boards

IN_DEVELOPMENT
IEC 61189-3-302 ED1
30.60 Close of voting/ comment period
May 31, 2024