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IEC 61189-2/AMD1/FRAG18 ED1

Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards IEC 61189-2/AMD1/FRAG18 ED1

General information

30.97   End of interruption of work - split/merged   Jul 7, 1995

IEC

TC 91

International Standard

Life cycle

NOW

ABANDON
IEC 61189-2/AMD1/FRAG18 ED1
30.97 End of interruption of work - split/merged
Jul 7, 1995

REVISED BY

PUBLISHED
IEC 61189-2:2006 ED2




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