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IEC 61189-2-809 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA IEC 61189-2-809 ED1

General information

50.00 Final text received or FDIS registered for formal approval   Mar 14, 2024

CFDIS    Jun 6, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-2-809 ED1
50.00 Final text received or FDIS registered for formal approval
Mar 14, 2024