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IEC 61189-2-809 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA IEC 61189-2-809 ED1

General information

60.00 Standard under publication   Nov 15, 2024

PPUB    Dec 27, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Scope

IEC 61189-2-809 ED1 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-2-809 ED1
60.00 Standard under publication
Nov 15, 2024