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IEC 61189-2-808:2024 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method IEC 61189-2-808:2024 ED1

Publication date:   Apr 25, 2024

General information

60.60 Standard published   Apr 25, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

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PUBLISHED
IEC 61189-2-808:2024 ED1
60.60 Standard published
Apr 25, 2024