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IEC 61189-2-807:2021 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA IEC 61189-2-807:2021 ED1

Publication date:   Sep 3, 2021

General information

60.60 Standard published   Sep 3, 2021

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

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PUBLISHED
IEC 61189-2-807:2021 ED1
60.60 Standard published
Sep 3, 2021