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IEC 61189-2-805:2024 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA IEC 61189-2-805:2024 ED1

Publication date:   Apr 18, 2024

General information

60.60 Standard published   Apr 18, 2024

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.

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PUBLISHED
IEC 61189-2-805:2024 ED1
60.60 Standard published
Apr 18, 2024