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IEC 61189-2-804:2023 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 IEC 61189-2-804:2023 ED1

Publication date:   Aug 25, 2023

General information

60.60 Standard published   Aug 25, 2023

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

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PUBLISHED
IEC 61189-2-804:2023 ED1
60.60 Standard published
Aug 25, 2023