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IEC 61189-2-803:2023 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards IEC 61189-2-803:2023 ED1

Publication date:   Jul 26, 2023

General information

60.60 Standard published   Jul 26, 2023

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

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PUBLISHED
IEC 61189-2-803:2023 ED1
60.60 Standard published
Jul 26, 2023