IEC 61189-2-721:2015 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator IEC 61189-2-721:2015 ED1

Publication date:   Apr 29, 2015

General information

60.60 Standard published   Apr 29, 2015

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.

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PUBLISHED
IEC 61189-2-721:2015 ED1
60.60 Standard published
Apr 29, 2015