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IEC 61189-2-501:2022 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials IEC 61189-2-501:2022 ED1

Publication date:   Feb 3, 2022

General information

60.60 Standard published   Feb 3, 2022

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

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PUBLISHED
IEC 61189-2-501:2022 ED1
60.60 Standard published
Feb 3, 2022